Thermal Gap Pads
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Thermal Interface Materials

Thermal Gap Pads

Thermally conductive silicone pads that fill air gaps and move heat where it needs to go.

Overview

What it is

Thermal gap pads sit between a heat source and a heat sink, filling microscopic air voids that would otherwise impede dissipation. The TS series spans nine conductivity grades — from 1 to 17 W/m·K — so you can match bond-line thickness and softness to the exact interface, from a delicate display module to an EV battery pack.

Key characteristics

  • Thermal conductivity up to 17 W/m·K (TS1700)
  • Bond-line thickness from 0.1 mm; thickness 0.25–20 mm
  • Shore 00 hardness from 5 to 90 — soft enough to protect fragile components
  • UL94 V0 flammability across the full lineup
Specifications

The numbers, grade by grade.

GradeTS100TS200TS300/400TS500/600TS700/800TS1100TS1700
Thermal conductivity (W/m·K)123–45–67–81117
Hardness (Shore 00)5–405–4030–4040–6040–707080
Flammability (UL94)V0V0V0V0V0V0V0
Working temp (°C)-55–200-55–200-55–200-55–200-55–200-55–200-55–200
Breakdown voltage (kV/mm)6666666
Test standards: ASTM D5470 / Hot Disc, ASTM D2240, ASTM D149/D257
Oil bleeding < 1% · Out-gassing < 0.1% · RoHS / REACH / Halogen-free: PASS
Colors: gray, white, pink, blue, green (customizable)
Where it's used

Typical applications

01

EV battery

02

Mobile phone & tablet

03

Notebook & digital camera

04

Router & test equipment

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