Thermal Interface Materials
Liquid TIM — Paste & Grease
Dispensable thermal paste and gap filler that flows into every void before it cures.
Dispensable thermal paste and gap filler that flows into every void before it cures.
Liquid TIM conforms to intricate, multi-level topographies. Because it flows before curing, it fills small air voids, crevices and holes that pads can't reach — cutting overall thermal resistance to the heat-generating device. Built for automated, high-throughput assembly in high-voltage electronics that demand efficient, consistent cooling.
| Property | Detail |
|---|---|
| Form | Paste / grease (dispensable, pre-cure flow) |
| Delivery | Pail, can, or syringe |
| Surface conformance | Multi-level, intricate topographies |
| Void filling | Small air voids, crevices, holes |
| Target | High-voltage electronics requiring efficient cooling |
High-voltage electronics cooling
Automated assembly lines
Complex / multi-level interfaces
EV power modules
Send us your application and target specs. Our engineers will match a grade and come back with a quote.